Free Practice CheckPoint 156-836 Exam Questions 2025

Stay ahead with 100% Free Check Point Certified Maestro Expert - R81 (CCME) 156-836 Dumps Practice Questions

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Total 83 Questions | Updated On: Apr 08, 2025

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Question 1

What is the purpose of interface bonding?

A : A bond interface can be configured for high availability redundancy.

B : A bond interface is used for passing synchronization traffic between the SGMs.

C : For load sharing which increases connection throughput above that which is possible using one physical interface.

D : A bond interface can be configured for high availability redundancy or for load sharing which increases connection throughput above that which is possible using one physical interface.

Answer: D

Question 2

What is the purpose of interface bonding?

A : A bond interface can be configured for high availability redundancy.

B : A bond interface is used for passing synchronization traffic between the SGMs.

C : For load sharing which increases connection throughput above that which is possible using one physical interface.

D : A bond interface can be configured for high availability redundancy or for load sharing which increases connection throughput above that which is possible using one physical interface.

Answer: D

Question 3

The SGM with the lowest member ID (the first one added to the security group.)

A : The MDS that pushes policy to the SMO is considered the SMO Master.

B : The first MHO configured is considered the SMO Master.

C : The SGM with the highest member ID (the last one added to the security group.)

D : What Maestro component is automatically designated the SMO Master?

Answer: D

Question 4

What command should be used for collecting diagnostic information about the orchestrator?

A : cpinfo

B : asg perf -v

C : cpview

D : orch_info

Answer: A

Question 5

What is the purpose of interface bonding?

A : A bond interface can be configured for high availability redundancy.

B : A bond interface is used for passing synchronization traffic between the SGMs.

C : For load sharing which increases connection throughput above that which is possible using one physical interface.

D : A bond interface can be configured for high availability redundancy or for load sharing which increases connection throughput above that which is possible using one physical interface.

Answer: D

Page: 1 / 17

Total 83 Questions | Updated On: Apr 08, 2025

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